Process Technology

Jun 08,2026

Metal Removal Mechanism of SC-2 Cleaning Solution

SC-2 cleaning solution (an HCl/H₂O₂/H₂O mixed system) leverages a triple synergistic mechanism—oxidation, complexation, and acid inhibition—to efficiently remove metallic contaminants from silicon wafer surfaces, achieving removal rates exceeding 99.99%.

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Metal Removal Mechanism of SC-2 Cleaning Solution

May 26,2026

SC-1 Cleaning Solution

SC-1 (Standard Clean 1) is a core step in the RCA cleaning process, formulated by mixing NH₄OH, H₂O₂, and H₂O in specific proportions.

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May 22,2026

Process Control and Safety in SPM

SPM (sulfuric acid–hydrogen peroxide mixture) is a highly oxidizing cleaning solution commonly used in semiconductor manufacturing, and its process control as well as safety and environmental management are of paramount importance.

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May 20,2026

SC-2 Cleaning Solution

SC-2 cleaning solution is one of the core steps in the RCA standard cleaning process, introduced by the U.S. company RCA in 1970 and specifically designed to remove alkali metal ions and heavy metal impurities from the surface of semiconductor wafers.

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May 15,2026

Main application scenarios of SPM in wafer cleaning

The two primary application scenarios for SPM are: removing hardened photoresist after ion implantation and eliminating organic contamination.

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Main application scenarios of SPM in wafer cleaning

May 12,2026

SPM Cleaning Solution: A Strong Oxidizing Decontaminant for Semiconductor Wet Etching

SPM (Sulfuric Acid/Hydrogen Peroxide Mixture), also known as Piranha Solution, is a highly oxidizing cleaning agent prepared by mixing concentrated sulfuric acid with hydrogen peroxide in specific proportions. Owing to its exceptionally strong oxidizing and dehydrating capabilities, it is widely used in semiconductor wet‑process applications for the removal of organic contaminants.

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SPM Cleaning Solution: A Strong Oxidizing Decontaminant for Semiconductor Wet Etching

May 07,2026

Wafer cleaning process

Wafer cleaning is a critical step in the semiconductor manufacturing process, accounting for approximately 20% of all process steps.

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Apr 29,2026

Semiconductor Wet Cleaning and Etching Processes

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Apr 23,2026

Common Issues in Wafer Wet Cleaning Processes and Corresponding Mitigation Measures

The wet‑process cleaning of conductive wafers has a decisive impact on device yield and reliability.

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Common Issues in Wafer Wet Cleaning Processes and Corresponding Mitigation Measures

Apr 15,2026

Wet Etching Equipment vs. Wet Cleaning Equipment: A Distinction in Positioning Between Core Patterning Processes and Comprehensive Process-Flow Support

In the semiconductor manufacturing process, wet etching equipment and wet cleaning equipment play distinctly different roles.

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Wet Etching Equipment vs. Wet Cleaning Equipment: A Distinction in Positioning Between Core Patterning Processes and Comprehensive Process-Flow Support

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