Process Technology

May 15,2026

Main application scenarios of SPM in wafer cleaning

The two primary application scenarios for SPM are: removing hardened photoresist after ion implantation and eliminating organic contamination.

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Main application scenarios of SPM in wafer cleaning

May 12,2026

SPM Cleaning Solution: A Strong Oxidizing Decontaminant for Semiconductor Wet Etching

SPM (Sulfuric Acid/Hydrogen Peroxide Mixture), also known as Piranha Solution, is a highly oxidizing cleaning agent prepared by mixing concentrated sulfuric acid with hydrogen peroxide in specific proportions. Owing to its exceptionally strong oxidizing and dehydrating capabilities, it is widely used in semiconductor wet‑process applications for the removal of organic contaminants.

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SPM Cleaning Solution: A Strong Oxidizing Decontaminant for Semiconductor Wet Etching

May 07,2026

Wafer cleaning process

Wafer cleaning is a critical step in the semiconductor manufacturing process, accounting for approximately 20% of all process steps.

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Apr 29,2026

Semiconductor Wet Cleaning and Etching Processes

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Apr 23,2026

Common Issues in Wafer Wet Cleaning Processes and Corresponding Mitigation Measures

The wet‑process cleaning of conductive wafers has a decisive impact on device yield and reliability.

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Common Issues in Wafer Wet Cleaning Processes and Corresponding Mitigation Measures

Apr 15,2026

Wet Etching Equipment vs. Wet Cleaning Equipment: A Distinction in Positioning Between Core Patterning Processes and Comprehensive Process-Flow Support

In the semiconductor manufacturing process, wet etching equipment and wet cleaning equipment play distinctly different roles.

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Wet Etching Equipment vs. Wet Cleaning Equipment: A Distinction in Positioning Between Core Patterning Processes and Comprehensive Process-Flow Support

Apr 13,2026

Etching emphasizes “control,” while cleaning emphasizes “purity”—differences in the core module configurations of wet etchers and wet cleaners

The process objectives and evaluation metrics for wet etching and wet cleaning differ fundamentally, resulting in distinctly divergent equipment design architectures.

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Etching emphasizes “control,” while cleaning emphasizes “purity”—differences in the core module configurations of wet etchers and wet cleaners

Apr 09,2026

Wet Etching Machine vs. Wet Cleaning Machine: A Battle Between “Precision” and “Cleanliness”

In the field of semiconductor wet processing, while both wet etchers and wet strippers rely on chemical reagents to interact with the wafer surface, their underlying process principles are fundamentally different.

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Wet Etching Machine vs. Wet Cleaning Machine: A Battle Between “Precision” and “Cleanliness”

Apr 01,2026

Optimization of Wet Etching Process Parameters

This section systematically outlines the key aspects of wet etching process optimization from four perspectives: control of “heat” in terms of temperature and time, strategies for enhancing uniformity, suppression of pit etching defects, and endpoint detection methods.

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Optimization of Wet Etching Process Parameters

Mar 27,2026

Common Wet Etching Formulations for Semiconductor Materials

A wide variety of materials are used in semiconductor manufacturing, among which silicon and its oxides, as well as silicon nitride, serve as the most fundamental substrate and dielectric materials; research on their etching recipes is the most mature and representative.

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Common Wet Etching Formulations for Semiconductor Materials

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