Process Technology

Mar 25,2026

The Core Role of Chemical Ratios in Wet Etching

Wet etching is one of the most fundamental and widely used patterning techniques in semiconductor manufacturing, with its core principle being the selective reaction between a chemical solution and the thin-film material.

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The Core Role of Chemical Ratios in Wet Etching

Mar 11,2026

Preventive Maintenance Content and Intervals for Semiconductor Wet-Process Equipment

Semiconductor wet-process equipment is critical process equipment in the chip manufacturing process, and its operational stability directly affects product yield and production efficiency. To ensure long‑term stable operation of the equipment, it is essential to develop a scientific and systematic preventive maintenance plan.

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Preventive Maintenance Content and Intervals for Semiconductor Wet-Process Equipment

Mar 09,2026

Application of the SC2 Wet Etching Process

Application of the SC2 Wet Etch Process

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Application of the SC2 Wet Etching Process

Mar 06,2026

Comparison of Wet-Process and Dry-Process Chip Manufacturing Techniques

By comparing wet etching processes and dry etching processes in chip manufacturing—including aspects such as etching methods, process uniformity, cost structure, and application fields—we can identify their key differences.

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Comparison of Wet-Process and Dry-Process Chip Manufacturing Techniques

Mar 02,2026

NMP wet-process technology

The NMP wet-etching process leverages the properties of a highly polar, aprotic solvent to dissolve thick photoresist, etched fluorocarbon polymers, and residual hard-shell layers from ion implantation through thermal soaking at 70–90℃. It is a critical post-processing step for removing photoresist. Combined with rinsing and residue-free drying, this process achieves high cleanliness and process consistency, ensuring the stability and reliability of subsequent manufacturing steps.

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Feb 02,2026

Introduction to Wafer Cleaning Equipment

After undergoing multiple manufacturing steps, wafers often have their surfaces contaminated by a large number of particles composed of polymers, photoresists, and etching residues. These particles and impurities can severely affect the geometric features and electrical performance of chips in subsequent processing steps.

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Introduction to Wafer Cleaning Equipment

Jan 21,2026

Post-CMP Cleaning

As the feature size of integrated circuits continues to shrink, the impact of chemical-mechanical polishing and subsequent cleaning processes in the back-end-of-line copper interconnect manufacturing on device performance and long-term reliability is becoming increasingly prominent.

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Jan 19,2026

The variation pattern of the selectivity ratio between SiO₂ and Si₃N₄ in BOE buffer solution at different temperatures.

BOE buffer solution, with its controllable etching rate and excellent material selectivity, is commonly used in integrated circuit manufacturing for patterning and removing SiO2 layers.

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The variation pattern of the selectivity ratio between SiO₂ and Si₃N₄ in BOE buffer solution at different temperatures.

Jan 15,2026

Post-etch cleaning

As the feature sizes of integrated circuits continue to shrink and three-dimensional structures become increasingly widespread, the importance of post-etch cleaning processes has grown significantly. Residues generated during etching not only affect the electrical performance of devices but can also lead to failures in subsequent process steps.

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Jan 09,2026

The Fundamentals and Reaction Mechanism of Wet Cleaning

In the semiconductor manufacturing process, contaminants on the wafer surface—including particles, organic substances, metal ions, and natural oxide films—can severely compromise device performance and reliability. Wet cleaning, which uses chemical solutions to regulate surface conditions at the nanoscale, not only removes these contaminants but also provides an ideal “starting point” for subsequent process steps such as thin-film deposition, photolithography, and etching.

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The Fundamentals and Reaction Mechanism of Wet Cleaning

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