Process Technology

Apr 13,2026

Etching emphasizes “control,” while cleaning emphasizes “purity”—differences in the core module configurations of wet etchers and wet cleaners

The process objectives and evaluation metrics for wet etching and wet cleaning differ fundamentally, resulting in distinctly divergent equipment design architectures.

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Etching emphasizes “control,” while cleaning emphasizes “purity”—differences in the core module configurations of wet etchers and wet cleaners

Apr 09,2026

Wet Etching Machine vs. Wet Cleaning Machine: A Battle Between “Precision” and “Cleanliness”

In the field of semiconductor wet processing, while both wet etchers and wet strippers rely on chemical reagents to interact with the wafer surface, their underlying process principles are fundamentally different.

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Wet Etching Machine vs. Wet Cleaning Machine: A Battle Between “Precision” and “Cleanliness”

Apr 01,2026

Optimization of Wet Etching Process Parameters

This section systematically outlines the key aspects of wet etching process optimization from four perspectives: control of “heat” in terms of temperature and time, strategies for enhancing uniformity, suppression of pit etching defects, and endpoint detection methods.

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Optimization of Wet Etching Process Parameters

Mar 27,2026

Common Wet Etching Formulations for Semiconductor Materials

A wide variety of materials are used in semiconductor manufacturing, among which silicon and its oxides, as well as silicon nitride, serve as the most fundamental substrate and dielectric materials; research on their etching recipes is the most mature and representative.

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Common Wet Etching Formulations for Semiconductor Materials

Mar 25,2026

The Core Role of Chemical Ratios in Wet Etching

Wet etching is one of the most fundamental and widely used patterning techniques in semiconductor manufacturing, with its core principle being the selective reaction between a chemical solution and the thin-film material.

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The Core Role of Chemical Ratios in Wet Etching

Mar 11,2026

Preventive Maintenance Content and Intervals for Semiconductor Wet-Process Equipment

Semiconductor wet-process equipment is critical process equipment in the chip manufacturing process, and its operational stability directly affects product yield and production efficiency. To ensure long‑term stable operation of the equipment, it is essential to develop a scientific and systematic preventive maintenance plan.

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Preventive Maintenance Content and Intervals for Semiconductor Wet-Process Equipment

Mar 09,2026

Application of the SC2 Wet Etching Process

Application of the SC2 Wet Etch Process

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Application of the SC2 Wet Etching Process

Mar 06,2026

Comparison of Wet-Process and Dry-Process Chip Manufacturing Techniques

By comparing wet etching processes and dry etching processes in chip manufacturing—including aspects such as etching methods, process uniformity, cost structure, and application fields—we can identify their key differences.

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Comparison of Wet-Process and Dry-Process Chip Manufacturing Techniques

Mar 02,2026

NMP wet-process technology

The NMP wet-etching process leverages the properties of a highly polar, aprotic solvent to dissolve thick photoresist, etched fluorocarbon polymers, and residual hard-shell layers from ion implantation through thermal soaking at 70–90℃. It is a critical post-processing step for removing photoresist. Combined with rinsing and residue-free drying, this process achieves high cleanliness and process consistency, ensuring the stability and reliability of subsequent manufacturing steps.

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Feb 02,2026

Introduction to Wafer Cleaning Equipment

After undergoing multiple manufacturing steps, wafers often have their surfaces contaminated by a large number of particles composed of polymers, photoresists, and etching residues. These particles and impurities can severely affect the geometric features and electrical performance of chips in subsequent processing steps.

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Introduction to Wafer Cleaning Equipment

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