Process Technology

Jan 07,2026

Temperature Control of SC-1 and SC-2 Solutions at Different Process Nodes

In semiconductor manufacturing, SC-1 (Standard Clean-1, an ammonia-hydrogen peroxide mixture) and SC-2 (Standard Clean-2, a hydrochloric acid-hydrogen peroxide mixture) are critical wet-etching cleaning processes. Temperature control for these processes must be finely optimized based on the process node, the type of contaminants, and the characteristics of the thin films, in order to ensure effective cleaning while minimizing damage to the device structure.

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Temperature Control of SC-1 and SC-2 Solutions at Different Process Nodes

Dec 29,2025

Mechanism of High-Temperature SPM Cleaning for Removing Contaminants from Nickel Surfaces

Wet chemical cleaning is one of the key technologies for removing surface contamination. Among these, the SPM solution—a mixture of sulfuric acid (H₂SO₄) and hydrogen peroxide (H₂O₂)—has emerged as an efficient cleaning agent thanks to its powerful oxidizing and dissolving capabilities. Particularly under high-temperature conditions, the reaction kinetics of the SPM solution are significantly enhanced, enabling it to effectively remove a wide variety of contaminants from nickel surfaces.

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Mechanism of High-Temperature SPM Cleaning for Removing Contaminants from Nickel Surfaces

Dec 23,2025

Cavitation effect of ultrasound

The cavitation effect of ultrasound is a unique physical phenomenon triggered when ultrasonic waves propagate through a medium. At its core, it involves the generation, growth, and collapse of tiny bubbles (cavitation bubbles) within the medium.

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Dec 17,2025

Technical Advantages of Fully Automatic Wet Etching and Cleaning Machines

The fully automatic wet etching and cleaning machine is an automated system specifically designed for surface treatment and cleaning of semiconductor wafers, electronic components, and microstructured devices.

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Technical Advantages of Fully Automatic Wet Etching and Cleaning Machines

Dec 12,2025

Wet-etching equipment cleaning solution

In the semiconductor manufacturing process, the cleanliness of the wafer surface directly affects device performance and yield. As a critical surface treatment process, wet cleaning hinges on the selection and formulation of chemical solutions.

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Dec 10,2025

Marangoni drying process parameters

As semiconductor process nodes shrink below 28 nm, traditional drying technologies can no longer meet the requirements for protecting high aspect-ratio structures and controlling nanoscale residues.

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Dec 01,2025

The working principle of a fully automatic degreasing and cleaning machine.

The fully automatic debonding and cleaning machine is a highly intelligent device that integrates automatic loading, cleaning, rinsing, and drying into one system. It is suitable for precision manufacturing applications such as FPC flexible printed circuit boards, LCD glass, camera modules, and semiconductor packaging.

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The working principle of a fully automatic degreasing and cleaning machine.

Nov 26,2025

The Process Differences Between QDR and FR

The process differences between QDR and FR definitions

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Nov 24,2025

SPM: A "Powerful Solvent" for Organic Compounds and Metals

SPM is the most "aggressive" step in the cleaning process, primarily responsible for removing stubborn organic residues (such as photoresist) and certain metal contaminants.

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SPM: A "Powerful Solvent" for Organic Compounds and Metals

Nov 19,2025

APM: The "Stripping Expert" for Particle Contamination

APM, short for Ammonium Hydroxide–Hydrogen Peroxide Mixture, is more widely known in the industry as SC-1 (Standard Clean-1).

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APM: The "Stripping Expert" for Particle Contamination

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