Process Technology

Apr 15,2025

Process parameter optimization analysis of high-temperature SPM cleaning technology in chip manufacturing

This paper systematically expounds the process principle of high-temperature SPM technology and the influence mechanism of key process parameters (temperature, concentration, flow mode) on cleaning performance. Through flow field modeling and optimization analysis, it provides theoretical support for equipment design and process improvement.

Key words:

Process parameter optimization analysis of high-temperature SPM cleaning technology in chip manufacturing

Apr 11,2025

The Key Guarantee of Chip Yield - Unveiling the "Invisible Guardian" in Semiconductor Manufacturing

In the precise world of chip manufacturing, a single micron-sized dust particle can ruin a wafer worth millions. Behind this, a "hidden technology"—the cleaning process—runs throughout the entire process, silently safeguarding the yield of each wafer.

Key words:

The Key Guarantee of Chip Yield - Unveiling the "Invisible Guardian" in Semiconductor Manufacturing

Apr 08,2025

Fluoroplastic Material Comparison: Appearance, Properties and Application Analysis of PTFE and PFA

Fluoroplastic Material Comparison: Appearance, Performance, and Application Analysis of PTFE and PFA

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Fluoroplastic Material Comparison: Appearance, Properties and Application Analysis of PTFE and PFA

Apr 03,2025

The key role of BOE etching technology in semiconductor manufacturing

BOE etching of silicon dioxide: An important step in semiconductor manufacturing processes

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The key role of BOE etching technology in semiconductor manufacturing

Apr 01,2025

The importance of CMP process in wafer manufacturing

CMP equipment is the carrier of CMP technology application, integrating advanced technologies from multiple fields such as tribology, surface/interface mechanics, molecular dynamics, precision manufacturing, chemistry and chemical engineering, and intelligent control. It is one of the most complex and difficult-to-develop equipment in integrated circuit manufacturing equipment. At the same time, due to the widespread use of copper interconnects in microprocessor production, CMP equipment, the only equipment capable of polishing copper metal layers, has become an essential tool for chip manufacturers.

Key words:

The importance of CMP process in wafer manufacturing

Mar 31,2025

CDS fluid supply system failure and troubleshooting

With the increasing automation of wet chemical equipment in fields such as LED, solar energy, MEMS, power devices, discrete devices, advanced packaging, and semiconductor materials, traditional manual liquid dispensing and replenishment are gradually being replaced by automatic liquid supply. In this process, the chemical delivery system (CDS) has become increasingly important. Its great advantages are particularly evident in applications requiring high-lift conveying and precise proportioning.

Key words:

CDS fluid supply system failure and troubleshooting

Mar 28,2025

RCA Cleaning Four-Step Method: Unveiling the Core Technology of Atomic-Level Cleanliness on Semiconductor Wafer Surfaces

In semiconductor manufacturing, atomic-level cleanliness of the wafer surface is critical to ensuring chip yield and performance. The RCA cleaning method, as the core process of wet cleaning, can efficiently remove contaminants such as particles, organic matter, metal ions, and oxide layers from the wafer surface through precise chemical solution ratios and process control. This article details the chemical principles, operational procedures, and technical advantages of the four-step RCA cleaning method, and discusses its key role in semiconductor manufacturing.

Key words:

RCA Cleaning Four-Step Method: Unveiling the Core Technology of Atomic-Level Cleanliness on Semiconductor Wafer Surfaces

Jul 31,2024

SPM Clean Technology - Sulfuric Acid Mixture Cleaning Operation Guide

SPM composition: 98% H2SO4:30% H2O2=5:1

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SPM Clean Technology - Sulfuric Acid Mixture Cleaning Operation Guide

Jul 31,2024

BOE Etching Process Introduction

BOE, also known as oxidation etching buffer, is a mixture of 40% NH4F and 49% HF.

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Jul 31,2024

Study on H3PO4 Etching of Silicon Nitride

Used to remove the Si3N4 layer used as a hard mask to prepare for the next step

Key words:

Study on H3PO4 Etching of Silicon Nitride

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