Process Technology

Dec 01,2025

The working principle of a fully automatic degreasing and cleaning machine.

The fully automatic debonding and cleaning machine is a highly intelligent device that integrates automatic loading, cleaning, rinsing, and drying into one system. It is suitable for precision manufacturing applications such as FPC flexible printed circuit boards, LCD glass, camera modules, and semiconductor packaging.

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The working principle of a fully automatic degreasing and cleaning machine.

Nov 26,2025

The Process Differences Between QDR and FR

The process differences between QDR and FR definitions

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Nov 24,2025

SPM: A "Powerful Solvent" for Organic Compounds and Metals

SPM is the most "aggressive" step in the cleaning process, primarily responsible for removing stubborn organic residues (such as photoresist) and certain metal contaminants.

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SPM: A "Powerful Solvent" for Organic Compounds and Metals

Nov 19,2025

APM: The "Stripping Expert" for Particle Contamination

APM, short for Ammonium Hydroxide–Hydrogen Peroxide Mixture, is more widely known in the industry as SC-1 (Standard Clean-1).

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APM: The "Stripping Expert" for Particle Contamination

Nov 17,2025

Applications of Semiconductor Cleaning Equipment

Semiconductor cleaning equipment plays a wide range of roles in the semiconductor manufacturing process, and its importance cannot be overlooked.

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Applications of Semiconductor Cleaning Equipment

Nov 12,2025

Types and Applications of Wet Etching Solutions

As semiconductor technology nodes continue to shrink, plasma-based dry etching has become the dominant process in integrated circuit manufacturing, thanks to its exceptional anisotropic etching capabilities.

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Types and Applications of Wet Etching Solutions

Nov 11,2025

Wafer Cleaning Methods After Etching

After wafer etching, cleaning is essential primarily to remove residual contaminants and impurities left over from the etching process, ensuring the cleanliness of the wafer surface.

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Nov 06,2025

Introduction to Wafer Cleaning Methods

Wafer cleaning is an indispensable and critical step in the semiconductor manufacturing process, aimed at effectively removing various contaminants from the wafer surface to ensure the quality and yield of subsequent processes.

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Nov 03,2025

Multi-process compatible liquid supply solution: How to reduce chemical reagent consumption by 30%?

In high-precision and advanced manufacturing fields such as semiconductor fabrication, display panel production, and photovoltaic cell manufacturing, the consumption of chemical reagents constitutes a significant portion of production costs.

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Multi-process compatible liquid supply solution: How to reduce chemical reagent consumption by 30%?

Oct 29,2025

The intelligent CDS liquid supply system achieves path-to-±1% concentration error control.

The path to achieving ±1% concentration error control in the intelligent CDS liquid supply system requires comprehensive measures spanning sensor technology, control algorithms, hardware optimization, and maintenance management.

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The intelligent CDS liquid supply system achieves path-to-±1% concentration error control.

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