Process Technology

Sep 19,2025

Fully Automatic RCA Cleaning System: Core Technology and Innovative Value in Semiconductor Manufacturing Cleanroom Processes

The fully automatic RCA cleaner is based on the classic RCA standard cleaning method, integrating chemical wet-process and physical cleaning mechanisms.

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Fully Automatic RCA Cleaning System: Core Technology and Innovative Value in Semiconductor Manufacturing Cleanroom Processes

Sep 17,2025

Metal Ion Contamination Control in Semiconductor Wet Cleaning Processes

The wet cleaning process in semiconductor manufacturing is used to remove metal ions, particles, and organic contaminants from the surface of wafers. Residual metal ions can severely compromise device performance, leading to issues such as leakage current, electromigration, or corrosion; hence, controlling their concentration is absolutely critical.

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Metal Ion Contamination Control in Semiconductor Wet Cleaning Processes

Sep 15,2025

Material of CDS liquid supply pipe

In the semiconductor manufacturing process, chlorine dioxide (CDS), as a strong oxidizing gas, its delivery system material selection directly affects process cleanliness, safety, and stability. The supply pipes must have excellent chemical corrosion resistance, high cleanliness, low metal ion leaching, and good thermal stability.

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Sep 11,2025

Factors Affecting Etching Accuracy in Wet Etching

The factors affecting the etching accuracy in wet etching mainly include chamber structure design, types and ratios of chemical agents, etching temperature, deionized water cleaning, and types of etching equipment. These factors work together to directly influence the uniformity, selectivity, and final accuracy of the etching process.

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Factors Affecting Etching Accuracy in Wet Etching

Sep 03,2025

Post-cleaning

Post-clean is a critical process step in semiconductor manufacturing, primarily used to remove by-products, reaction residues, and contaminants left after preceding processes such as etching and chemical mechanical polishing.

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Sep 01,2025

Pre-Clean

Pre-Clean is a critical step in the semiconductor manufacturing process, aimed at removing impurities and contaminants from the surface of silicon wafers to ensure the accuracy and stability of subsequent processes.

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Aug 29,2025

Key Measures for Particle Control in Wet Cleaning Equipment — Maintenance and Monitoring

In the wet cleaning process of semiconductor manufacturing, effectively controlling particle contamination is a core challenge to ensure wafer yield and device performance. Particles can cause device short circuits, open circuits, or performance degradation. Achieving low particle levels requires systematic measures from multiple dimensions, including source prevention and cleaning process optimization.

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Key Measures for Particle Control in Wet Cleaning Equipment — Maintenance and Monitoring

Aug 18,2025

Key Measures for Particle Control in Wet Cleaning Equipment - Process Control

In the wet cleaning process of semiconductor manufacturing, effectively controlling particle contamination is a core challenge to ensure wafer yield and device performance. Particles can cause device shorts, open circuits, or performance degradation. Achieving low particle levels requires systematic measures from multiple dimensions, including source prevention and cleaning process optimization.

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Key Measures for Particle Control in Wet Cleaning Equipment - Process Control

Aug 15,2025

The core role of ionized water in semiconductor wet cleaning

In semiconductor manufacturing, wet cleaning is a core process to ensure the performance and reliability of devices. As the feature size of integrated circuits continues to shrink, the negative impact of surface contaminants (such as metal ions, particles, and organic matter) on chip yield becomes increasingly significant.

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The core role of ionized water in semiconductor wet cleaning

Aug 13,2025

槽式清洗机在半导体制造中的功能

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