News_KOSEN SEMI

Sep 01,2025

Pre-Clean is a critical step in the semiconductor manufacturing process, aimed at removing impurities and contaminants from the surface of silicon wafers to ensure the accuracy and stability of subsequent processes.

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Sep 01,2025

Professor Zhang Jincheng and Professor Ning Jing from the team of Academician Hao Yue at Xidian University have made breakthrough progress in the field of diamond-based gallium oxide thermal management.

The Semiconductor Industry Network has learned that recently, a research team from Xidian University has made breakthrough progress in the field of wide bandgap semiconductor material integration through technical research. The related results will be published on August 31, 2025, titled "Van der Waals β-Ga2O3"

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Professor Zhang Jincheng and Professor Ning Jing from the team of Academician Hao Yue at Xidian University have made breakthrough progress in the field of diamond-based gallium oxide thermal management.

Aug 29,2025

Key Measures for Particle Control in Wet Cleaning Equipment — Maintenance and Monitoring

In the wet cleaning process of semiconductor manufacturing, effectively controlling particle contamination is a core challenge to ensure wafer yield and device performance. Particles can cause device short circuits, open circuits, or performance degradation. Achieving low particle levels requires systematic measures from multiple dimensions, including source prevention and cleaning process optimization.

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Key Measures for Particle Control in Wet Cleaning Equipment — Maintenance and Monitoring

Aug 29,2025

Basic Semiconductor has reached a strategic cooperation with Toshiba

Recently, Shenzhen Basic Semiconductor Co., Ltd. (hereinafter referred to as "Basic Semiconductor") and Toshiba Electronic Components & Storage Devices Corporation (hereinafter referred to as "Toshiba Electronic Components") officially signed a strategic cooperation agreement.

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Basic Semiconductor has reached a strategic cooperation with Toshiba

Aug 19,2025

1200V Vertical GaN-on-Si MOSFET

Shandong University and Huawei Technologies Co., Ltd. have achieved 1200V breakdown performance in fully vertical gallium nitride (GaN) on silicon (Si) trench metal-oxide-semiconductor field-effect transistors using fluorine (F) ion implantation termination (FIT) in China [Yuchuan Ma et al., IEEE Electron Device Letters, published online July 8, 2025].

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Aug 18,2025

Key Measures for Particle Control in Wet Cleaning Equipment - Process Control

In the wet cleaning process of semiconductor manufacturing, effectively controlling particle contamination is a core challenge to ensure wafer yield and device performance. Particles can cause device shorts, open circuits, or performance degradation. Achieving low particle levels requires systematic measures from multiple dimensions, including source prevention and cleaning process optimization.

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Key Measures for Particle Control in Wet Cleaning Equipment - Process Control

Aug 18,2025

India Approves Four Semiconductor Projects, Including First Compound Semiconductor Wafer Fab

Indian officials recently announced the approval of 4 new semiconductor projects under the India Semiconductor Mission (ISM) framework, bringing the total number of ISM projects from 6 to 10. These 4 projects involve approximately 46 billion rupees (approximately 3.777 billion yuan) in investment.

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India Approves Four Semiconductor Projects, Including First Compound Semiconductor Wafer Fab

Aug 15,2025

The core role of ionized water in semiconductor wet cleaning

In semiconductor manufacturing, wet cleaning is a core process to ensure the performance and reliability of devices. As the feature size of integrated circuits continues to shrink, the negative impact of surface contaminants (such as metal ions, particles, and organic matter) on chip yield becomes increasingly significant.

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The core role of ionized water in semiconductor wet cleaning

Aug 13,2025

槽式清洗机在半导体制造中的功能

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Aug 12,2025

ASMPT announced the closure of its semiconductor equipment factory in Shenzhen, China

On August 11, ASMPT, a world-leading semiconductor and electronics manufacturing company, announced a strategic adjustment and optimization of its equipment production and operations in China.

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ASMPT announced the closure of its semiconductor equipment factory in Shenzhen, China

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