News_KOSEN SEMI

Aug 11,2025

Key Measures for Particle Control in Wet Cleaning Equipment—Source Prevention and Control

Particles can cause short circuits, open circuits, or performance degradation in devices. Achieving low particle counts requires a systematic approach involving multiple dimensions, including source prevention, cleaning process optimization, equipment maintenance, and environmental management.

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Key Measures for Particle Control in Wet Cleaning Equipment—Source Prevention and Control

Aug 08,2025

Megahertz ultrasonic cleaning: a technological engine for micron-level cleanliness

In modern precision manufacturing and scientific research, cleanliness is a core element determining product quality and performance. Faced with increasingly stringent cleaning requirements, megasonic cleaning technology, with its high-frequency, high-efficiency, and precise characteristics, has become an innovative force that breaks through traditional cleaning bottlenecks, providing crucial cleanliness assurance for high-end industries.

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Megahertz ultrasonic cleaning: a technological engine for micron-level cleanliness

Aug 07,2025

Trump will impose a 100% tariff on chips

U.S. President Trump announced plans to impose a 100% tariff on imported semiconductors, but...

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Trump will impose a 100% tariff on chips

Aug 06,2025

The impact of particle contamination in wafer manufacturing

Particle contamination in wafer manufacturing can affect the quality, performance, and reliability of the final chip product in several ways.

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The impact of particle contamination in wafer manufacturing

Aug 05,2025

Boshi Microelectronics packaging project put into production, monthly production capacity will exceed 200 million pieces!

On August 1, Powerchip Semiconductor (Tianjin) Co., Ltd. (hereinafter referred to as "Powerchip Semiconductor") officially commenced production at the Microelectronics Innovation Industrial Park in Tianjin Economic Development Area. This news is like a pebble dropped into the lake of the semiconductor industry, causing ripples.

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Boshi Microelectronics packaging project put into production, monthly production capacity will exceed 200 million pieces!

Aug 01,2025

Common solutions for wet etching

Commonly used wet etching solutions include phosphoric acid, hydrofluoric acid, buffered oxide etchant (BOE), aluminum etchant (M2), and nitric acid.

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Jul 31,2025

The United States has exempted semiconductor equipment manufactured in the EU from a 15% tariff.

On July 27, 2025 local time, US President Trump and European Commission President von der Leyen reached a new trade agreement. Under the agreement, the US will impose a 15% tariff on most goods from the EU, significantly lower than the previously threatened 30%. Simultaneously, the EU pledged an additional $600 billion investment in the US.

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The United States has exempted semiconductor equipment manufactured in the EU from a 15% tariff.

Jul 30,2025

SC-2 Cleaning Solution Composition

SC-2 Cleaning Solution Application Areas: Semiconductor manufacturing (RCA standard cleaning process) Core Function: Removes metal contaminants and organic residues from the wafer surface

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Jul 29,2025

Eight major integrated circuit projects, including the expansion of China Resources' testing and packaging capacity, with a total investment of 4.25 billion yuan, have been signed in Chongqing.

According to the Chongqing High-tech Zone Media Center, on July 28, eight leading enterprises in the integrated circuit field signed agreements with Chongqing High-tech Zone, with a total investment of 4.25 billion yuan.

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Eight major integrated circuit projects, including the expansion of China Resources' testing and packaging capacity, with a total investment of 4.25 billion yuan, have been signed in Chongqing.

Jul 28,2025

Steps for cleaning silicon wafers

Wafer cleaning is a crucial process in semiconductor manufacturing, aimed at removing surface contaminants (particles, organic matter, metal ions, native oxide layers, etc.) to ensure the quality and yield of subsequent processes (such as lithography, oxidation, diffusion, and thin film deposition).

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