News-KOSEN SEMI

Aug 11,2026

Wet‑cleaning equipment serves semiconductor wafer fabrication, integrated circuit packaging and testing, MEMS (micro‑electromechanical systems), optoelectronic devices, nanomaterial synthesis, and other applications, where it is used to remove particles, organic residues, metallic contaminants, and native oxide layers from the surfaces of chips and substrates.

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Aug 05,2026

NVIDIA’s orders are putting pressure on TSMC’s CoWoS capacity, with the core CoW process being shifted to external packaging and testing firms.

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Jul 31,2026

SEMI Report: Global silicon wafer shipments are expected to grow 7.4% year over year in the second quarter of 2026.

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Jul 29,2026

Total investment of RMB 20 billion: latest updates on the Silan Jihua project.

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Jul 27,2026

Application of Megasonic Cleaning Technology Throughout the Entire Wafer Manufacturing Process

Megasonic Cleaning is a critical wet‑process cleaning technology in advanced semiconductor manufacturing. By generating cavitation and acoustic streaming in the cleaning solution through high‑frequency sound waves—typically in the range of 0.8 to 2 MHz—it achieves highly efficient removal of sub‑micron particles, organic residues, and metallic contaminants from wafer surfaces.

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Application of Megasonic Cleaning Technology Throughout the Entire Wafer Manufacturing Process

Jul 15,2026

ESDA Report: Sales in the electronic systems design industry reached US$5.7 billion in the first quarter of 2026.

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Jul 10,2026

GlobalWafers and Micron deepen their decade-long strategic supply partnership.

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Jul 06,2026

Principle and Parameter Control of the SC-1 Cleaning Process

SC‑1 (Standard Cleaning 1) is one of the most critical steps in semiconductor wet‑process cleaning. At its core, it employs an NH₄OH/H₂O₂/deionized water mixture that relies on the synergistic effects of oxidation and etching to remove particulates and organic contaminants.

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Principle and Parameter Control of the SC-1 Cleaning Process

Jul 01,2026

SEMI Report: Forecasts 300mm fab equipment investment to exceed US$50 billion by 2026.

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Jun 15,2026

Process Control and Safety Precautions for SC-2 Cleaning Solution

SC-2 cleaning solution (a strong acid–strong oxidant mixture) plays a critical role in semiconductor wet‑process cleaning, but it suffers from a narrow process window and high safety risks.

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Process Control and Safety Precautions for SC-2 Cleaning Solution

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