RCA cleaning machine

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RCA cleaning machine

Cleaning methods commonly used in semiconductor manufacturing processes

Process Step
Application area
介绍

- Commodity name: RCA cleaning machine
Cleaning methods commonly used in semiconductor manufacturing processes
- STEP 1: SPM slot
- STEP 2: HQDR slot
- STEP 3: SC-1
- STEP 4: QDR slot
- STEP 5: SC-2
- STEP 6: QDR slot
- STEP 7: Drying
Used in wafer manufacturing for cleaning before and after thin-film deposition, before dry etching, after ion implantation, before and after grinding, before and after annealing, before and after polishing, as well as in chemical wet etching cleaning processes.
RCA cleaning typically includes four steps: first, an acidic oxidation clean using sulfuric acid-based hydrogen peroxide; second, an alkaline oxidation clean using amine-based hydrogen peroxide; third, cleaning with dilute hydrofluoric acid solution; and finally, an acidic oxidation clean using hydrochloric acid-based hydrogen peroxide. After each cleaning step, ultra-pure water (DIW) rinsing is performed, followed by drying with a low-boiling-point organic solvent.

This process is primarily used to clean chemicals and impurities from the wafer surface.
- Final Cleaning
- Wafer pre-cleaning
- Pre-sputtering cleaning
- Pre-oxidation cleaning

EKC Clean

Horizontal Quartz Tube Basket Cleaning Machine

EKC Clean

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RCA cleaning typically includes four steps: first, an acidic oxidation clean using sulfuric acid-based hydrogen peroxide; second, an alkaline oxidation clean using amine-based hydrogen peroxide; third, cleaning with dilute hydrofluoric acid solution; and finally, an acidic oxidation clean using hydrochloric acid-based hydrogen peroxide. After each cleaning step, ultra-pure water (DIW) rinsing is performed, followed by drying with a low-boiling-point organic solvent.

This process is primarily used to clean chemicals and impurities from the wafer surface.

Final Cleaning
Wafer pre-cleaning
Pre-sputtering cleaning
Pre-oxidation cleaning

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