News_KOSEN SEMI

Dec 12,2025

In the semiconductor manufacturing process, the cleanliness of the wafer surface directly affects device performance and yield. As a critical surface treatment process, wet cleaning hinges on the selection and formulation of chemical solutions.

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Dec 11,2025

SK Hynix and NVIDIA Join Forces to Develop Next-Generation AI SSDs

At the event, SK Hynix Vice President Kim Cheon-sung announced the company’s collaboration with NVIDIA to develop next-generation SSDs.

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SK Hynix and NVIDIA Join Forces to Develop Next-Generation AI SSDs

Dec 10,2025

Marangoni drying process parameters

As semiconductor process nodes shrink below 28 nm, traditional drying technologies can no longer meet the requirements for protecting high aspect-ratio structures and controlling nanoscale residues.

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Dec 09,2025

The Sun Qian team at the Suzhou Institute of Nano-Tech and Nano-Bionics has achieved new progress in the field of low-voltage RF devices based on gallium nitride.

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Dec 06,2025

SEMI Report: Global semiconductor equipment shipments in the third quarter of 2025 increased by 11% year-on-year.

In the third quarter of 2025, global semiconductor equipment shipments increased by 11% year-on-year.

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SEMI Report: Global semiconductor equipment shipments in the third quarter of 2025 increased by 11% year-on-year.

Dec 04,2025

New Advances in the Development of High-Efficiency AlGaN Deep-Ultraviolet Light-Emitting Diodes and in the Study of Photon Transport Behavior

Recently, the research groups led by Associate Professor Chu Chunshuang, Professor Zhang Yonghui, and Professor Zhang Zihui from Guangdong University of Technology and Hebei University of Technology, in collaboration with the research group led by Associate Researcher Liu Naixin and Researcher Yan Jianchang from the Institute of Semiconductors, Chinese Academy of Sciences, have achieved significant breakthroughs in enhancing the light extraction efficiency of AlGaN-based deep-ultraviolet light-emitting diodes (DUV LEDs), improving hole injection efficiency, and reducing the barrier at the metal/p-type semiconductor interface.

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New Advances in the Development of High-Efficiency AlGaN Deep-Ultraviolet Light-Emitting Diodes and in the Study of Photon Transport Behavior

Dec 03,2025

Targeting the advanced packaging market, Intel is partnering with Amkor Korea to deploy EMIB production capacity.

According to recent reports from South Korean media, Intel has established a production line for its advanced packaging technology “EMIB” within Amkor’s K5 factory in Songdo, South Korea.

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Targeting the advanced packaging market, Intel is partnering with Amkor Korea to deploy EMIB production capacity.

Dec 01,2025

The working principle of a fully automatic degreasing and cleaning machine.

The fully automatic debonding and cleaning machine is a highly intelligent device that integrates automatic loading, cleaning, rinsing, and drying into one system. It is suitable for precision manufacturing applications such as FPC flexible printed circuit boards, LCD glass, camera modules, and semiconductor packaging.

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The working principle of a fully automatic degreasing and cleaning machine.

Nov 27,2025

The U.S. Launches 337 Investigation Against Chinese Companies Including Hisense, TCL, and Skyworth

The U.S. International Trade Commission (ITC) voted to formally initiate a Section 337 investigation—investigation code: 337-TA-1462—into certain liquid crystal devices, components, and their downstream products.

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The U.S. Launches 337 Investigation Against Chinese Companies Including Hisense, TCL, and Skyworth

Nov 26,2025

The Process Differences Between QDR and FR

The process differences between QDR and FR definitions

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