Industry News_KOSEN SEMI

Mar 24,2026

HK$800 Million Investment Launches Hong Kong’s First Semiconductor Equipment Manufacturing Base Project

Recently, Hong Kong Science and Technology Parks Corporation and Eastmicro Electronics Hong Kong Limited (hereinafter referred to as “Eastmicro Electronics”) held the groundbreaking ceremony for the Semiconductor Equipment Manufacturing Base Project at the Yuen Long Innovation Park in Hong Kong.

Key words:

HK$800 Million Investment Launches Hong Kong’s First Semiconductor Equipment Manufacturing Base Project

Mar 19,2026

The global semiconductor equipment industry is entering a period of intensive breakthroughs.

As the “mother machine” of the semiconductor industry chain, the direction of technological iteration in semiconductor equipment to a certain extent determines the trajectory of the chip industry.

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The global semiconductor equipment industry is entering a period of intensive breakthroughs.

Mar 17,2026

Suzhou Pan-Semiconductor Advanced Process and Automation Equipment Production Base Project Commences Operations

On the morning of March 14, the commissioning ceremony for the production base project of Suzhou Guangsi’ao Optoelectronics Technology Co., Ltd.—focused on high-end processes and automated equipment for the broader semiconductor manufacturing sector—was successfully held.

Key words:

Suzhou Pan-Semiconductor Advanced Process and Automation Equipment Production Base Project Commences Operations

Mar 10,2026

Ansemi Semiconductor (China) – Small‑Batch Mass Production of 12‑inch Wafer Bipolar Discrete Devices

On March 9, onsemi (China) announced that, through its innovative “12‑inch platform” developed in-house, it has successfully achieved small‑batch production of 12‑inch wafer bipolar discrete devices.

Key words:

Ansemi Semiconductor (China) – Small‑Batch Mass Production of 12‑inch Wafer Bipolar Discrete Devices

Mar 05,2026

Guo Yufeng, a member of the National Committee of the Chinese People's Political Consultative Conference, says that domestically produced chips are accelerating their upgrade, making the leap from merely usable to truly user-friendly.

“At this year’s Two Sessions, I’ll bring a new business laptop powered by domestically produced chips.”

Key words:

Guo Yufeng, a member of the National Committee of the Chinese People's Political Consultative Conference, says that domestically produced chips are accelerating their upgrade, making the leap from merely usable to truly user-friendly.

Feb 27,2026

ASML says its next-generation EUV equipment is now ready for mass production, marking a critical turning point for AI chip manufacturing.

According to Reuters, an ASML executive revealed that the company’s next-generation chip-manufacturing equipment is now ready, and chipmakers can begin mass production.

Key words:

ASML says its next-generation EUV equipment is now ready for mass production, marking a critical turning point for AI chip manufacturing.

Feb 03,2026

Shanghai: Vigorously cultivate and develop future industries such as fourth-generation semiconductors.

The fourth session of the 16th Shanghai Municipal People's Congress opened on the morning of February 3 at the Expo Center.

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Shanghai: Vigorously cultivate and develop future industries such as fourth-generation semiconductors.

Jan 30,2026

Jingce Electronics has completed construction of its 12-inch advanced packaging R&D line and has begun investing in the expansion project for its Shanghai Phase II laboratory.

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Jan 26,2026

Intel is announcing that glass substrate technology has now entered mass production.

Recently, Intel announced that its glass-substrate technology has reached high-volume manufacturing (HVM). At the heart of this technology is Intel’s advanced facility located in Chandler, Arizona, which represents one of the most significant transformations in the semiconductor packaging field in nearly three decades.

Key words:

Intel is announcing that glass substrate technology has now entered mass production.

Jan 22,2026

Total investment of 25.2 billion yuan! The Guangdong Xinxin Semiconductor 480,000-wafer-per-year production line project is launched.

On January 22, the launch ceremony for the fourth-phase project of Yuexin Semiconductor was held in Huangpu District, Guangzhou.

Key words:

Total investment of 25.2 billion yuan! The Guangdong Xinxin Semiconductor 480,000-wafer-per-year production line project is launched.

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