Industry News_KOSEN SEMI

Apr 27,2026

With a total investment of RMB 2 billion, the Fulede Yangtze River 12-inch wafer recycling project has officially broken ground in Hefei Xinzhuan High-tech Industrial Development Zone.

At 11:00 a.m. on April 23, 2026, the groundbreaking ceremony for the 12-inch semiconductor wafer refurbishment project of Fulede Changjiang (Hefei) Semiconductor Materials Co., Ltd. was officially held in the Hefei New Station High-tech Industrial Development Zone, marking the launch of another major project in China’s wafer refurbishment sector. This initiative will inject new momentum into the high-quality development of Hefei’s integrated circuit industry and provide robust support for the independent and controllable operation of China’s semiconductor industrial chain.

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With a total investment of RMB 2 billion, the Fulede Yangtze River 12-inch wafer recycling project has officially broken ground in Hefei Xinzhuan High-tech Industrial Development Zone.

Apr 24,2026

Global satellite chip market experiencing robust growth, poised to become the next billion-dollar market.

According to a report on April 20 by the German business newspaper Handelsblatt, demand for semiconductors driven by artificial intelligence has propelled manufacturers such as NVIDIA into the ranks of the world’s highest-valued companies. Yet beyond this stock-market boom, another multi-billion-dollar market is quietly taking shape: satellite chips.

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Global satellite chip market experiencing robust growth, poised to become the next billion-dollar market.

Apr 23,2026

Leading domestic analog chip company, Suntel Microelectronics, Makes a Move in Optics Valley

Recently, the leading domestic analog integrated circuit company, Sinochip Microelectronics (Beijing) Co., Ltd. (hereinafter referred to as “Sinochip Microelectronics”), signed an agreement with Guanggu Central City to establish a Central China R&D Center.

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Leading domestic analog chip company, Suntel Microelectronics, Makes a Move in Optics Valley

Apr 21,2026

ESDA Report: Electronic Systems Design Industry Sales Reach $5.5 Billion in Q4 2025

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Apr 14,2026

ESDA Report: Electronic Systems Design Industry Sales Reach $5.5 Billion in Q4 2025

On April 13, 2026, Pacific Time in California, the Electronic System Design Alliance (ESDA), a technical community under SEMI, announced in its latest Electronic Design Market Data Report (EDMD) that sales in the electronic system design (ESD) industry reached US$5.4663 billion in the fourth quarter of 2025.

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Apr 10,2026

Intel Develops World’s Thinnest Gallium Nitride Chiplet, Just 19 Micrometers Thick

Intel Foundry Services has just achieved a new milestone by successfully developing the world’s first—and thinnest—gallium nitride chiplet, with a thickness of only 19 micrometers.

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Intel Develops World’s Thinnest Gallium Nitride Chiplet, Just 19 Micrometers Thick

Apr 07,2026

SEMI Report: Forecasts Two-Digit Growth in Global 300mm Wafer Fab Equipment Spending in 2026 and 2027

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Apr 02,2026

TSMC’s “Japan Second Fab” Confirmed for Upgrade: Mass Production of 3-Nanometer Chips in 2028!

According to reports, TSMC, the world’s largest chip foundry, plans to begin mass production of advanced 3-nanometer (3nm) chips in Japan in 2028.

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TSMC’s “Japan Second Fab” Confirmed for Upgrade: Mass Production of 3-Nanometer Chips in 2028!

Mar 30,2026

Hunan Sanan’s diamond-based solution: laser chip thermal resistance reduced by 81.1% compared with ceramic substrates.

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Mar 26,2026

China’s First 8-Inch Mass-Production Line for Silicon Photonics Chips Commences Construction in Suzhou

According to Xinhua Daily, the silicon photonics platform of Suzhou Xingyao Photonics Technology Co., Ltd. broke ground in Suzhou High-Tech Industrial Development Zone on March 24, with commissioning expected by the end of this year.

Key words:

China’s First 8-Inch Mass-Production Line for Silicon Photonics Chips Commences Construction in Suzhou

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